Company is a leading global supplier of high performance components for the mobile phone market.
. Work activities concerned with design, testing and manufacturing of components, products and systems . Engineering work assignments are broad in nature . Applies technical knowledge to completion of assignments . Qualified candidate needs to have experience in design and development of microelectronics packaging, components and assemblies. . Knowledge and experience with various materials for low-cost, high-volume and high reliability . Candidate is responsible for all Engineering related documentation, such as drawings, specifications and test requirements. . Work with Manufacturing Engineering and Supply Chain departments to achieve target costs and cost schedules . Demonstrate ability to innovate and apply diverse engineering skill sets to solve complex engineering problems is desired . Ability to multi-task within a fast paced , dynamic environment . Team player, detail-oriented, self-motivated and able to work independently with minimal guidance . Good verbal and written communication skills
. Convert prototype designs into detailed drawings and production prints. . Assist in design of new products and technology platforms . Provide recommendations or modifications as appropriate . Produce PCB fabrication prints and specifications from schematics . Handle requisitions, quotes and placement of purchase orders for R&D prototypes . Coordinate Design Review Meetings . Work with manufacturing engineers and suppliers for design concept interpretation . Work with process engineers in developing platform design rules . Work with quality engineers in modifying designs and specifications as required . Acquire and apply new knowledge as required by dynamic product development environment . Search for and evaluate new suppliers and the viability of new packaging technologies . Participation in development of Product Specification . Analysis of design to applicable standards or marketing specifications
. BS Degree in Mechanical, Electrical or Materials Science Engineering, advanced degree a plus. . Minimum 5 years of related experience . Full understanding of mechanical design and engineering concepts . Experienced in SolidWorks and/or AutoCAD (or QuickCAD) . Knowledge of Geometric Dimensioning and Tolerancing, tolerance stack-up principles and understanding of real-world fabrication processes . Basic knowledge of Semiconductor materials and Semiconductor fabrication processes . Experience with PCB materials and PCB fabrication processes . Experience with ceramic substrate materials and fabrication processes . Software skills including MSOffice, Excel and statistical analysis are required
Bottom Line Requirements:
1. BS Degree in Mechanical, Electrical or Materials Science Engineering(advanced degree a plus). 2. 5 + years of related experience. 3. Experienced in SolidWorks and/or AutoCAD (or QuickCAD). 4. Experience with Geometric Dimensioning and Tolerancing, tolerance stack-up principles and understanding of real-world fabrication processes. 5. Experience with Semiconductor materials and Semiconductor fabrication processes, PCB materials and PCB fabrication processes. 6. Experience with ceramic substrate materials and fabrication processes.