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Tel Deep Trench Silicon Etcher - Telius Sp 308 Qs

Posted By:
Emily Tan
Posting ID:
 tel   deep   trench   silicon   etcher   telius 
Item Category:Electronics

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TEL Deep Trench Silicon Etcher-TELIUS SP 308 QS
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Model:TEL Deep Trench Silicon Etcher-TELIUS SP 308QS
Condition:Used,complete,crated,working before crating.
Amount:3 sets
TEL Deep Trench Silicon Etcher Model: TELIUS SP 308 QS ETCH TOOL, (4) CHAMBERS, 5 loader ports, 300mm FOUP, Load Locker Modules,4 Deep Trench Silicon Etcher (SCCM) Super Capacitively Coupled Module Chambers,40MHz and 3.2MHz dual Frequency Source (GEW3040 and NOVA50A),ESD chuck, Temperature Control.
1. Chamber: Aluminum Alloy Chamber, Aluminum Alloy (A6061), Hard Sulfuric Acid Anodizing Surface finishing.
2. RF application method: Apply upper RF to lower electrode, SCCM Type Discharge method.
3. Temperature control: Apply upper RF to lower electrode;
4. Upper electrode: Upper electrode is by Heater and Cooling Water. Lower electrode is by circulating coolant. Side wall is by heater.
5. Upper electrode: Quartz Cover or Aluminum Alloy(A6061) with Hard Sulfuric Acid Anodizing.
6. Shield ring:
7. Lower electrode: Ceramics electro static chuck with Thermometer. Wafer holding method is Electrostatic chuck(¶’300) mechanism.
8. Focus ring :Quartz.
9. Exhaust Plate: Aluminum Alloy with Hard Sulfuric Acid Anodizing.
10. Insulation ring: Quartz Cover or Aluminum Alloy(A6061) with Hard Sulfuric Acid Anodizing.
11. Distance between electrodes: 30°ę35 mm.
12. Magnet: Intensity:170G(center), Rotation:20+-1rpm.
13. Pressure monitor: Each chamber has following three kind of pressure monitor.
14. He B.P UNIT: Cooling Gas for Wafer back, PCV(STEC) Pressure Switch, Two lines line/control (Center/Edge),0~7980Pa(0~60Torr) range of pressure, He Leakage monitor, VALVE ON/OFF sensor for Detection of valve open/close.
15. End point detection : SE2000.
16. Confirmation of luminescence.
17. WINDOW: Orifice(Quartz).
18. Deposition shield: Use removable depo-shield(The material is quartz) for easy cleaning of process chamber.
19. Shutter: Aluminium Alloy with Hard Sulfuric Anodizing Plate, Air Cylinder Drive.
20. Final Valve: Diaphragm Type MEGA-One (Fujikin)°°
21. APC
22. Manifold: Aluminium Alloy with Hard Sulfuric Anodizing
23. O-ring for Chamber:: Chemratz
24. Specifications for performance: (1)Ultimate Vacuum: 0.0133 Pa(7.5*10-2 mTorr) or less; £®2£©Leak Back:0.133 Pa/min(1 mTorr/min) or less.

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